**Amkor Technology Secures New Site for Peoria Semiconductor Facility**
Amkor Technology has officially committed to constructing its new semiconductor chip packaging and testing facility on a newly acquired site in Peoria, Arizona, following local community concerns about the company’s initial location.
In response to resident opposition near the originally proposed site, the Town of Peoria intervened by acquiring a more suitable parcel of land through an Arizona State Land auction. The town purchased 834 acres near Loop 303 and Lake Pleasant Parkway for $46.7 million. Officials expect to recoup up to $500 million through future land sales and development surrounding the project.
Shortly after the land acquisition, the town finalized its deal with Amkor, which is eager to begin construction immediately.
Once completed, the Amkor facility is projected to be the largest outsourced semiconductor packaging plant in the United States. It will handle a significant portion of chip packaging and testing for the Taiwan Semiconductor Manufacturing Co. facility located in North Phoenix. The project is expected to bring approximately 2,000 jobs to the area and drive substantial economic growth in Peoria and the broader West Valley region.
